Invention Grant
- Patent Title: Process for coating electrically conductive substrates
- Patent Title (中): 涂覆导电基材的方法
-
Application No.: US11568523Application Date: 2005-05-25
-
Publication No.: US07862851B2Publication Date: 2011-01-04
- Inventor: Heinrich Wonnemann , Lars Hof , Werner Blömer
- Applicant: Heinrich Wonnemann , Lars Hof , Werner Blömer
- Applicant Address: DE Munster
- Assignee: BASF Coatings AG
- Current Assignee: BASF Coatings AG
- Current Assignee Address: DE Munster
- Agency: Cantor Colburn LLP
- Priority: DE102004027650 20040605
- International Application: PCT/EP2005/052407 WO 20050525
- International Announcement: WO2005/120724 WO 20051222
- Main IPC: B05D5/12
- IPC: B05D5/12 ; C09D5/00

Abstract:
A process for coating electrically conductive substrates by (1) applying an electrocoat film to an electrically conductive substrate and curing it to give an electrocoat and then (2) applying a layer of a pulverulent coating material to the electrocoat and curing it to give a powder coat or alternatively (1) applying an electrocoat film to an electrically conductive substrate and drying it without fully curing it, (2) applying a layer of a pulverulent coating material to the dried electrocoat film(s) and (3) jointly curing the dried electrocoat film and the layer of the pulverulent coating material to give the electrocoat and the powder coat wherein the pulverulent coating material comprises (A) at least one epoxy resin having a melting point, melting range or glass transition temperature>30° C., (B) at least one carboxyl-containing polyester resin having a melting point, melting range or glass transition temperature>30° C., and (C) at least one polycarboxylic acid having a melting point of between 80 and 160° C.
Public/Granted literature
- US20070224337A1 Process For Coating Electrically Conductive Subsstrates Public/Granted day:2007-09-27
Information query