Invention Grant
- Patent Title: Label for in-mold formation
- Patent Title (中): 模内成型标签
-
Application No.: US10909291Application Date: 2004-08-03
-
Publication No.: US07862881B2Publication Date: 2011-01-04
- Inventor: Takatoshi Nishizawa , Hiroshi Koike
- Applicant: Takatoshi Nishizawa , Hiroshi Koike
- Applicant Address: JP Tokyo
- Assignee: Yupo Corporation
- Current Assignee: Yupo Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2002-027119 20020204
- Main IPC: B41M5/00
- IPC: B41M5/00 ; B44C1/17 ; G03G7/00

Abstract:
A label for in-mold formation is provided which can be readily delaminated from the container by any one because of its excellent delamination initiation property and delamination transmission property as well as its low interlaminar strength, and which can be recorded with information such as pictures and letters on the inner side concealed by the label, and therefore, enabling effective utilization of the display area, or utilization of the delaminated label portion as a request form or a discount ticket, so called coupon.The present invention discloses a label for in-mold formation which includes a base layer (A) containing a thermoplastic resin, a layer (B) which enables delamination, and a heat seal layer (D) in this order; the aforementioned label for in-mold formation which includes an intermediate layer (C) between the layer (B) which enables delamination and the heat seal layer (D); and a resin molded product with a label to which the label for in-mold formation is attached to integrate with such a resin molded product by thermal fusion.
Public/Granted literature
- US20050058831A1 Label for in-mold formation Public/Granted day:2005-03-17
Information query