Invention Grant
- Patent Title: Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
- Patent Title (中): 粘合辅助剂金属箔，印刷线路板和印刷线路板的制造方法
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Application No.: US12613222Application Date: 2009-11-05
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Publication No.: US07862889B2Publication Date: 2011-01-04
- Inventor: Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- Applicant: Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-024456 20040130; JP2004-116726 20040412
- Main IPC: B32B15/04
- IPC: B32B15/04 ; H05K1/02
Abstract:
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
Public/Granted literature
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