Invention Grant
US07862981B2 Compound, positive resist composition and method of forming resist pattern
失效
化合物，正性抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Compound, positive resist composition and method of forming resist pattern
- Patent Title (中): 化合物，正性抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US11917458Application Date: 2006-06-07
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Publication No.: US07862981B2Publication Date: 2011-01-04
- Inventor: Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant: Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2005-177504 20050617
- International Application: PCT/JP2006/311443 WO 20060607
- International Announcement: WO2006/134814 WO 20061221
- Main IPC: G03C1/00
- IPC: G03C1/00 ; C07C39/12
Abstract:
A compound including a polyhydric phenol compound represented by general formula (I) shown below (wherein R11 to R17 each independently represents an alkyl group of 1 to 10 carbon atoms or aromatic hydrocarbon group which may contain a hetero atom in the structure thereof, and X represents an aliphatic cyclic group) and having a molecular weight of 300 to 2,500, in which some or all of the hydrogen atoms of the phenolic hydroxyl groups are substituted with acid dissociable, dissolution inhibiting groups; a positive resist composition containing the compound; and a method of forming a resist pattern using the positive resist composition.
Public/Granted literature
- US20100009284A1 COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2010-01-14
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