Invention Grant
US07863096B2 Embedded die package and process flow using a pre-molded carrier
有权
使用预成型载体的嵌入式模具封装和工艺流程
- Patent Title: Embedded die package and process flow using a pre-molded carrier
- Patent Title (中): 使用预成型载体的嵌入式模具封装和工艺流程
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Application No.: US12175171Application Date: 2008-07-17
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Publication No.: US07863096B2Publication Date: 2011-01-04
- Inventor: Luke England
- Applicant: Luke England
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Hiscock & Barclay, LLP
- Agent Thomas R. FitzGerald, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal conductors, each of which is in contact with at least one of the vias, one or more additional dielectric layers lying over the metal conductors and the first dielectric layer, wherein a top layer of the one or more dielectric layers has openings with metalization underneath coupled to at least one of the metal conductors, and solder bumps protruding from each of the openings.
Public/Granted literature
- US20100013087A1 EMBEDDED DIE PACKAGE AND PROCESS FLOW USING A PRE-MOLDED CARRIER Public/Granted day:2010-01-21
Information query
IPC分类:
