Invention Grant
- Patent Title: Method of producing a thin semiconductor chip
- Patent Title (中): 薄半导体芯片的制造方法
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Application No.: US12246983Application Date: 2008-10-07
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Publication No.: US07863104B2Publication Date: 2011-01-04
- Inventor: Werner Kroeninger , Manfred Kotek , Adolf Koller , Abdul Rahman Mohamed
- Applicant: Werner Kroeninger , Manfred Kotek , Adolf Koller , Abdul Rahman Mohamed
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of fabricating a semiconductor chip includes the providing an adhesive layer on the outer area of the active surface of a device wafer and attaching a rigid body to the active surface by the adhesive layer. The device wafer is thinned by treating the passive surface of the device wafer. A first backing tape is connected to the passive surface of the device wafer. The outer portion of the rigid body is separated from the central portion of the rigid body and the outer portion of the device wafer is separated from the central portion of the device wafer. The central portion of the rigid body, the outer portion of the device wafer and the outer portion of the rigid body are removed from the first backing tape. The device wafer may be diced into semiconductor chips.
Public/Granted literature
- US20090098684A1 Method of Producing a Thin Semiconductor Chip Public/Granted day:2009-04-16
Information query
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