Invention Grant
- Patent Title: Image sensor package and forming method of the same
- Patent Title (中): 图像传感器封装及其形成方法相同
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Application No.: US12117087Application Date: 2008-05-08
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Publication No.: US07863105B2Publication Date: 2011-01-04
- Inventor: Wen-Kun Yang , Jui-Hsien Chang
- Applicant: Wen-Kun Yang , Jui-Hsien Chang
- Applicant Address: TW Hsinchu County
- Assignee: Advanced Chip Engineering Technology Inc.
- Current Assignee: Advanced Chip Engineering Technology Inc.
- Current Assignee Address: TW Hsinchu County
- Agency: Kusner & Jaffe
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.
Public/Granted literature
- US20080206918A1 IMAGE SENSOR PACKAGE AND FORMING METHOD OF THE SAME Public/Granted day:2008-08-28
Information query
IPC分类:
