Invention Grant
US07863109B2 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
有权
集成电路封装系统，其具有在内部堆叠模块上的突起及其制造方法
- Patent Title: Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
- Patent Title (中): 集成电路封装系统，其具有在内部堆叠模块上的突起及其制造方法
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Application No.: US12329482Application Date: 2008-12-05
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Publication No.: US07863109B2Publication Date: 2011-01-04
- Inventor: Seng Guan Chow , Rui Huang , Heap Hoe Kuan
- Applicant: Seng Guan Chow , Rui Huang , Heap Hoe Kuan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/04
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing an inner stacking module die; encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface; and encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.
Public/Granted literature
Information query
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