Invention Grant
- Patent Title: Method and resulting structure using silver for LCOS devices
- Patent Title (中): LCOS器件使用银的方法和结果
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Application No.: US12234382Application Date: 2008-09-19
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Publication No.: US07863145B2Publication Date: 2011-01-04
- Inventor: Yanghui Oliver Xiang , Enlian Lu
- Applicant: Yanghui Oliver Xiang , Enlian Lu
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN Shanghai
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/336 ; H01L21/331 ; H01L21/76

Abstract:
A method for fabricating an LCOS device. The method includes providing a semiconductor substrate and forming a plurality of MOS transistor devices formed on a portion of the semiconductor substrate. The method includes forming a first dielectric layer overlying the plurality of transistor devices and forming a first metal layer overlying the first dielectric layer. The method includes forming a second dielectric layer overlying the first metal layer and forming a plurality of pixel regions made substantially of silver bearing material overlying the second dielectric layer. In a preferred embodiment, the silver bearing material has much higher reflectivity for wavelengths of 450 nanometers and greater.
Public/Granted literature
- US20100072481A1 Method and Resulting Structure Using Silver for LCOS Devices Public/Granted day:2010-03-25
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