Invention Grant
- Patent Title: Plasma doping method and plasma doping apparatus
- Patent Title (中): 等离子体掺杂法和等离子体掺杂装置
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Application No.: US11531637Application Date: 2006-09-13
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Publication No.: US07863168B2Publication Date: 2011-01-04
- Inventor: Tomohiro Okumura , Ichiro Nakayama , Bunji Mizuno , Yuichiro Sasaki
- Applicant: Tomohiro Okumura , Ichiro Nakayama , Bunji Mizuno , Yuichiro Sasaki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Sheridan Ross P.C.
- Priority: JP2002-290074 20021002; JP2002-290075 20021002; JP2002-290076 20021002
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/265

Abstract:
In order to realize a plasma doping method capable of carrying out a stable low-density doping, exhaustion is carried out with a pump while introducing a predetermined gas into a vacuum chamber from a gas supplying apparatus, the pressure of the vacuum chamber is held at a predetermined pressure and a high frequency power is supplied to a coil from a high frequency power source. After the generation of plasma in the vacuum chamber, the pressure of the vacuum chamber is lowered, and the low-density plasma doping is performed to a substrate placed on a substrate electrode. Moreover, the pressure of the vacuum chamber is gradually lowered, and the high frequency power is gradually increased, thereby the low-density plasma doping is carried out to the substrate placed on the substrate electrode. Furthermore, a forward power Pf and a reflected power Pr of the high frequency power supplied to the substrate electrode are sampled at a high speed, and when a value of which the power difference Pf-Pr is integrated with respect to time reaches a predetermined value, the supply of the high frequency power is suspended.
Public/Granted literature
- US20070026649A1 Plasma Doping Method and Plasma Doping Apparatus Public/Granted day:2007-02-01
Information query
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