Invention Grant
- Patent Title: Chemical solution feeding apparatus and method for preparing slurry
- Patent Title (中): 化学溶液进料装置及其制备方法
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Application No.: US12076168Application Date: 2008-03-14
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Publication No.: US07863195B2Publication Date: 2011-01-04
- Inventor: Naoki Hiraoka , Hiroshi Osuda , Hotaka Yamamoto
- Applicant: Naoki Hiraoka , Hiroshi Osuda , Hotaka Yamamoto
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2001-371944 20011205
- Main IPC: B24B37/04
- IPC: B24B37/04

Abstract:
An apparatus for feeding slurry to an external device. The apparatus includes a preparation tank for preparing the slurry. A circulation pipe is connected to the preparation tank to circulate the slurry. A feeding pipe is connected between the preparation tank and the external device to feed the external device with the slurry. A pump sends the chemical solution in the preparation tank to the circulation pipe and the feeding pipe. A concentration detector is arranged downstream to the pump to detect the concentration of the slurry. A controller controls the concentration of the chemical solution in the preparation tank in accordance with the detection value of the concentration detector and controls the feeding of the chemical solution.
Public/Granted literature
- US20080214005A1 Chemical solution feeding apparatus and method for preparing slurry Public/Granted day:2008-09-04
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