Invention Grant
- Patent Title: Method of enhancing hole mobility
- Patent Title (中): 增强空穴迁移率的方法
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Application No.: US11561496Application Date: 2006-11-20
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Publication No.: US07863653B2Publication Date: 2011-01-04
- Inventor: Henry K. Utomo , Judson R. Holt , Haining S. Yang
- Applicant: Henry K. Utomo , Judson R. Holt , Haining S. Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb I.P. Law Firm, LLC
- Agent Ian D. McKinnon, Esq.
- Main IPC: H01L27/10
- IPC: H01L27/10

Abstract:
A semiconductor device is provided comprising an oxide layer over a first silicon layer and a second silicon layer over the oxide layer, wherein the oxide layer is between the first silicon layer and the second silicon layer. The first silicon layer and the second silicon layer comprise the same crystalline orientation. The device further includes a graded germanium layer on the first silicon layer, wherein the graded germanium layer contacts a spacer and the first silicon layer and does not contact the oxide layer. A lower portion of the graded germanium layer comprises a higher concentration of germanium than an upper portion of the graded germanium layer, wherein a top surface of the graded germanium layer lacks germanium.
Public/Granted literature
- US20080116484A1 METHOD OF ENHANCING HOLE MOBILITY Public/Granted day:2008-05-22
Information query
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