Invention Grant
- Patent Title: Zirconium titanium oxide films
- Patent Title (中): 锆钛氧化物膜
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Application No.: US11212306Application Date: 2005-08-26
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Publication No.: US07863667B2Publication Date: 2011-01-04
- Inventor: Kie Y. Ahn , Leonard Forbes
- Applicant: Kie Y. Ahn , Leonard Forbes
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94

Abstract:
Dielectric layers having an atomic layer deposited oxide containing titanium and zirconium and a method of fabricating such a dielectric layer produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO2. Pulsing a titanium-containing precursor onto a substrate, and pulsing a zirconium-containing precursor to form an oxide containing Zr and Ti by atomic layer deposition provides a dielectric layer with a relatively high dielectric constant as compared with silicon oxide. A zirconium-containing precursor to form the oxide containing Zr and Ti can include zirconium tertiary-butoxide.
Public/Granted literature
- US20050280067A1 Atomic layer deposited zirconium titanium oxide films Public/Granted day:2005-12-22
Information query
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