Invention Grant
- Patent Title: Semiconductor devices and methods of fabricating the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11709814Application Date: 2007-02-23
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Publication No.: US07863676B2Publication Date: 2011-01-04
- Inventor: Sang-Hun Jeon , Jung-Dal Choi , Chang-Seok Kang , Won-Seok Jung
- Applicant: Sang-Hun Jeon , Jung-Dal Choi , Chang-Seok Kang , Won-Seok Jung
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co. Ltd.
- Current Assignee: Samsung Electronics Co. Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2006-0102566 20061020
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a device isolation layer in a semiconductor substrate, an active region defined by the device isolation layer, the active region including a main surface and a recess region including a bottom surface that is lower than the main surface, and a gate electrode formed over the recess region, wherein a top surface of the device isolation layer adjacent to the recess region is lower than the bottom surface of the recess region.
Public/Granted literature
- US20080093656A1 Semiconductor devices and methods of fabricating the same Public/Granted day:2008-04-24
Information query
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