Invention Grant
- Patent Title: High integrated semiconductor memory device
- Patent Title (中): 高集成半导体存储器件
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Application No.: US12344700Application Date: 2008-12-29
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Publication No.: US07863684B2Publication Date: 2011-01-04
- Inventor: Tae Su Jang
- Applicant: Tae Su Jang
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2008-0068128 20080714
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/108 ; H01L29/94

Abstract:
Disclosed herein is a semiconductor memory device including plural unit cells, each constituted with a floating body transistor without any capacitor, to prevent data distortion and data crash in the unit cell. A semiconductor memory device comprises plural active regions and a device isolation layer for separating each active region from each others, wherein the plural active regions stand in row and column lines.
Public/Granted literature
- US20100006938A1 High Integrated Semiconductor Memory Device Public/Granted day:2010-01-14
Information query
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