Invention Grant
US07863695B2 Complementary MISFET semiconductor device having an atomic density ratio aluminum/lanthanum (Al/La) in the gate insulating layer of PMIS is larger than that of the NMIS
有权
在PMIS的栅极绝缘层中具有铝/镧原子密度比(Al / La)的互补MISFET半导体器件大于NMIS
- Patent Title: Complementary MISFET semiconductor device having an atomic density ratio aluminum/lanthanum (Al/La) in the gate insulating layer of PMIS is larger than that of the NMIS
- Patent Title (中): 在PMIS的栅极绝缘层中具有铝/镧原子密度比(Al / La)的互补MISFET半导体器件大于NMIS
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Application No.: US12200599Application Date: 2008-08-28
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Publication No.: US07863695B2Publication Date: 2011-01-04
- Inventor: Masamichi Suzuki , Masato Koyama , Yoshinori Tsuchiya , Hirotaka Nishino , Reika Ichihara , Akira Takashima
- Applicant: Masamichi Suzuki , Masato Koyama , Yoshinori Tsuchiya , Hirotaka Nishino , Reika Ichihara , Akira Takashima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2007-287870 20071105
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238

Abstract:
A complementary semiconductor device includes a semiconductor substrate, a first semiconductor region formed on a surface of the semiconductor substrate, a second semiconductor region formed on the surface of the semiconductor substrate apart from the first semiconductor region, an n-MIS transistor having a first gate insulating film including La and Al, formed on the first semiconductor region, and a first gate electrode formed on the gate insulating film, and a p-MIS transistor having a second gate insulating film including La and Al, formed on the second semiconductor region, and a second gate electrode formed on the gate insulating film, an atomic density ratio Al/La in the second gate insulating film being larger than an atomic density ratio Al/La in the first gate insulating film.
Public/Granted literature
- US20090114995A1 COMPLEMENTARY SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-05-07
Information query
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