Invention Grant
US07863726B2 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
有权
集成电路封装系统，其具有具有角接触件的封装基板及其制造方法
- Patent Title: Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
- Patent Title (中): 集成电路封装系统，其具有具有角接触件的封装基板及其制造方法
-
Application No.: US12612630Application Date: 2009-11-04
-
Publication No.: US07863726B2Publication Date: 2011-01-04
- Inventor: Seng Guan Chow , Tae Hoan Jang
- Applicant: Seng Guan Chow , Tae Hoan Jang
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/02 ; H01L29/40 ; H01L23/28 ; H01L23/29 ; H01L23/544 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A method of manufacture of an integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.
Public/Granted literature
Information query
IPC分类:
