Invention Grant
- Patent Title: Integrated circuit with multiple layers of circuits
- Patent Title (中): 具有多层电路的集成电路
-
Application No.: US12007480Application Date: 2008-01-10
-
Publication No.: US07863733B2Publication Date: 2011-01-04
- Inventor: Krisztian Flautner , Robert Campbell Aitken , Stephen John Hill
- Applicant: Krisztian Flautner , Robert Campbell Aitken , Stephen John Hill
- Applicant Address: GB Cambridge
- Assignee: ARM Limited
- Current Assignee: ARM Limited
- Current Assignee Address: GB Cambridge
- Agency: Nixon & Vanderhye P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/82 ; H01L23/02 ; H01L23/34

Abstract:
An integrated circuit 78 is formed of multiple layers of circuits 14, 16 superimposed to produce stacks of circuit blocks 2, 4. Stack control circuitry 18, 20 is associated with the input and output signals from the circuit blocks to direct these to/from the currently active circuit block(s) as appropriate. The superimposed circuit blocks 2, 4 provide redundancy for each other, both for manufacturing defect resistance and for operational redundancy, such as providing multiple modular redundancy in safety critical environments.
Public/Granted literature
- US20090015322A1 Integrated circuit with multiple layers of circuits Public/Granted day:2009-01-15
Information query
IPC分类: