Invention Grant
- Patent Title: Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof
- Patent Title (中): 能够抑制晶片状态翘曲的半导体装置及其制造方法
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Application No.: US12507188Application Date: 2009-07-22
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Publication No.: US07863750B2Publication Date: 2011-01-04
- Inventor: Junji Shiota , Taisuke Koroku , Nobumitsu Fujii , Osamu Kuwabara , Osamu Okada
- Applicant: Junji Shiota , Taisuke Koroku , Nobumitsu Fujii , Osamu Kuwabara , Osamu Okada
- Applicant Address: JP Tokyo
- Assignee: Casio Computer Co., Ltd.
- Current Assignee: Casio Computer Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2008-190440 20080724
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/053 ; H01L23/12
Abstract:
In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.
Public/Granted literature
- US20100019371A1 SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING IN A WAFER STATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-01-28
Information query
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