Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11896997Application Date: 2007-09-07
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Publication No.: US07863753B2Publication Date: 2011-01-04
- Inventor: Chiaki Kudo , Hisashi Ogawa
- Applicant: Chiaki Kudo , Hisashi Ogawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-254239 20060920
- Main IPC: H01L29/41
- IPC: H01L29/41

Abstract:
A semiconductor device includes: an isolation region formed in a semiconductor substrate; an active region surrounded by the isolation region; and a first gate electrode formed on the isolation region and the active region and including a first region on the isolation region. The first region has a pattern width in a gate length direction larger than a pattern width of the first gate electrode on the active region. The first region includes a part having a film thickness different from a film thickness of the first gate electrode on the active region.
Public/Granted literature
- US20080067611A1 Semiconductor device and manufacturing method thereof Public/Granted day:2008-03-20
Information query
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