Invention Grant
- Patent Title: Roll-to-roll fabricated encapsulated semiconductor circuit devices
- Patent Title (中): 卷对卷制造的封装半导体电路器件
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Application No.: US11543705Application Date: 2006-10-03
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Publication No.: US07863760B2Publication Date: 2011-01-04
- Inventor: John J. Daniels , Gregory Victor Nelson
- Applicant: John J. Daniels , Gregory Victor Nelson
- Applicant Address: US CT Mansfield Center
- Assignee: LumaChip, Inc.
- Current Assignee: LumaChip, Inc.
- Current Assignee Address: US CT Mansfield Center
- Agency: Michaud-Kinney Group LLP
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/29
Abstract:
An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.
Public/Granted literature
- US20070026571A1 Roll-to-roll fabricated encapsulated semiconductor circuit devices Public/Granted day:2007-02-01
Information query
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