Invention Grant
- Patent Title: Light-emitting device and method of manufacturing light-emitting device
- Patent Title (中): 发光元件及其制造方法
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Application No.: US11466668Application Date: 2006-08-23
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Publication No.: US07863809B2Publication Date: 2011-01-04
- Inventor: Hiroshi Sera , Hideto Ishiguro
- Applicant: Hiroshi Sera , Hideto Ishiguro
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-254495 20050902; JP2006-145226 20060525
- Main IPC: H01L51/40
- IPC: H01L51/40 ; H05B33/10

Abstract:
A method of manufacturing a light-emitting device, in which a light-emitting body is sealed between a substrate and a sealing body, includes forming a light-emitting layer, made of a light emitting material, on the surface of the substrate; forming the sealing body which partially covers the light-emitting layer; and removing portions of the light-emitting layer, which are not covered by the sealing body, using the sealing body as a mask, thereby forming the light-emitting body.
Public/Granted literature
- US20070053202A1 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE Public/Granted day:2007-03-08
Information query
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