Invention Grant
- Patent Title: Three-dimensional chip-stack synchronization
- Patent Title (中): 三维芯片堆栈同步
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Application No.: US12432801Application Date: 2009-04-30
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Publication No.: US07863960B2Publication Date: 2011-01-04
- Inventor: Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
- Applicant: Ping-Chuan Wang , Anthony R. Bonaccio , Jong-Ru Guo , Louis Lu-Chen Hsu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent H. Daniel Schnurmann
- Main IPC: G06F1/04
- IPC: G06F1/04

Abstract:
A central reference clock is placed in a substantially middle chip of a 3-D chip-stack. The central reference clock is distributed to each child chip of the 3-D chip-stack, so that a plurality of clocks is generated for each individual chip in the 3-D-stack in a synchronous manner. A predetermined number of through-silicon-vias and on-chip wires are employed to form a delay element for each slave clock, ensuring that the clock generated for each child chip is substantially synchronized. Optionally, an on-chip clock trimming circuit is embedded for further precision tuning to eliminate local clock skews.
Public/Granted literature
- US20100277210A1 THREE-DIMENSIONAL CHIP-STACK SYNCHRONIZATION Public/Granted day:2010-11-04
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