Techniques for improving the quality factor (“Q”) of a balun in the presence of loading stages are disclosed. In an exemplary embodiment, the ground node of a balun secondary (single-ended) element is connected to a source node of an amplifier stage via a common ground node. The connection may be made physically short to minimize any parasitic elements. In another exemplary embodiment, the common ground node may be coupled to an off-chip ground voltage via a peaking inductor. The peaking inductor may be implemented on-chip, e.g., as a spiral inductor, or off-chip e.g., using bondwires.