Invention Grant
- Patent Title: Integrated circuit device
- Patent Title (中): 集成电路器件
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Application No.: US12269396Application Date: 2008-11-12
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Publication No.: US07864021B2Publication Date: 2011-01-04
- Inventor: Kenichi Matsushita , Ichiro Omura
- Applicant: Kenichi Matsushita , Ichiro Omura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-299481 20071119
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/00 ; G05F1/00

Abstract:
An integrated circuit device includes: a main interconnect; and a coil located on one side of the main interconnect at a position fixed with respect to the main interconnect, the coil having a central axis extending in a direction crossing the extending direction of the main interconnect. An induction current detectable by the coil is generated due to a current flowing through the main interconnect.
Public/Granted literature
- US20090128279A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2009-05-21
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