Invention Grant
US07864125B2 Dual-band coupling device comprising first and second annular grooves being fed by first and second feed conductors
有权
包括由第一和第二馈电导体馈送的第一和第二环形槽的双频带耦合装置
- Patent Title: Dual-band coupling device comprising first and second annular grooves being fed by first and second feed conductors
- Patent Title (中): 包括由第一和第二馈电导体馈送的第一和第二环形槽的双频带耦合装置
-
Application No.: US12259974Application Date: 2008-10-28
-
Publication No.: US07864125B2Publication Date: 2011-01-04
- Inventor: Kuo-Fong Hung , Yi-Cheng Lin
- Applicant: Kuo-Fong Hung , Yi-Cheng Lin
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Priority: TW97112780A 20080409
- Main IPC: H01Q13/22
- IPC: H01Q13/22 ; H01P1/161
Abstract:
A coupling device is provided. The coupling device has a substrate, a ground element, a first feed conductor and a second feed conductor. The substrate has a first surface and a second surface. The ground element is disposed on the second surface, wherein the ground element has a first annular groove, a second annular groove and a feed slot, the second annular groove surrounds the first annular groove, the feed slot is connected to the first annular groove and the second annular groove. The first feed conductor is disposed on the first surface corresponding to the first annular groove and the second annular groove, wherein the first feed conductor couples the ground element to feed an electric current. The second feed conductor is disposed on the first surface corresponding to the feed slot, wherein the second feed conductor couples the feed slot to feed a magnetic current.
Public/Granted literature
- US20090256653A1 DUAL-BAND COUPLING DEVICE Public/Granted day:2009-10-15
Information query
