Invention Grant
US07864299B2 Apparatus for supporting a wafer, apparatus for exposing a wafer and method of supporting a wafer
有权
用于支撑晶片的装置，用于暴露晶片的装置和支撑晶片的方法
- Patent Title: Apparatus for supporting a wafer, apparatus for exposing a wafer and method of supporting a wafer
- Patent Title (中): 用于支撑晶片的装置，用于暴露晶片的装置和支撑晶片的方法
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Application No.: US11889871Application Date: 2007-08-17
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Publication No.: US07864299B2Publication Date: 2011-01-04
- Inventor: Jae-Hyun Sung , Jong-Min Kim
- Applicant: Jae-Hyun Sung , Jong-Min Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.LC.
- Priority: KR10-2006-0077762 20060817
- Main IPC: G03B27/58
- IPC: G03B27/58 ; G03B27/52 ; G03B27/42 ; G03B27/60 ; G03B27/62
Abstract:
In an apparatus for supporting a wafer, the apparatus may remove particles thereon. The apparatus may include a conductive support configured to support the wafer, and a power source electrically connected to the conductive support, the power source configured to provide at least one current to the conductive support to remove particles from the conductive support.
Public/Granted literature
- US20080068582A1 Apparatus for supporting a wafer, apparatus for exposing a wafer and method of supporting a wafer Public/Granted day:2008-03-20
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