Invention Grant
- Patent Title: Cover assembly for electronic device
- Patent Title (中): 电子设备盖组件
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Application No.: US12503849Application Date: 2009-07-16
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Publication No.: US07864511B2Publication Date: 2011-01-04
- Inventor: Wen-Yan Yang
- Applicant: Wen-Yan Yang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200910300917 20090317
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00

Abstract:
A cover assembly includes a housing plate and a cover. The housing plate includes a first wall, a second wall, a third wall, and a fourth wall. The housing plate defines a rectangular opening. The first, second, third, and fourth walls are formed at the four edges of the rectangular opening. The housing plate defines a first positioning slot in the first wall, two second positioning slots at one end of the second wall and the third wall adjacent to the first wall, and a third positioning slot at a side of the rectangular opening. The cover includes a front end, an opposite rear end, a first locking sheet on the middle of the front end, two second locking sheets on both sides of the front end, and two third locking sheets on the inner surface of the disassembly portion and protruding from the rear end to the front end.
Public/Granted literature
- US20100238613A1 COVER ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2010-09-23
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