Invention Grant
- Patent Title: Keypad module for mobile electronic device
- Patent Title (中): 移动电子设备键盘模块
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Application No.: US12482063Application Date: 2009-06-10
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Publication No.: US07864513B2Publication Date: 2011-01-04
- Inventor: Ming-Pin Chen
- Applicant: Ming-Pin Chen
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent D. Austin Bonderer
- Priority: CN200920301126 20090306
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A keypad module for a mobile electronic device is provided. The mobile electronic device has a main body. The keypad module includes a receiving bracket adapted to be mounted on the main body. A flexible circuit board is arranged in the receiving bracket. A switching sheet is located above the flexible circuit board, and capable of actuating the flexible circuit board to produce electrical signal. A rubber sheet is disposed on the switching sheet, and shielding cover sits on the rubber sheet. Wherein the shielding cover is secured to receiving bracket. The shielding cover and the receiving bracket cooperatively define a receiving housing to accommodate the flexible circuit, the switching sheet, and the rubber sheet.
Public/Granted literature
- US20100226084A1 KEYPAD MODULE FOR MOBILE ELECTRONIC DEVICE Public/Granted day:2010-09-09
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