Invention Grant
US07864523B2 Cooling device for accommodated printed circuit board in a chassis
有权
用于机箱内容纳印刷电路板的冷却装置
- Patent Title: Cooling device for accommodated printed circuit board in a chassis
- Patent Title (中): 用于机箱内容纳印刷电路板的冷却装置
-
Application No.: US12412593Application Date: 2009-03-27
-
Publication No.: US07864523B2Publication Date: 2011-01-04
- Inventor: Yoshihisa Iwakiri
- Applicant: Yoshihisa Iwakiri
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2008-087529 20080328
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.
Public/Granted literature
- US20090244842A1 COOLING DEVICE FOR ACOMMODATED PRINTED CIRCUIT BOARD IN A CHASSIS Public/Granted day:2009-10-01
Information query