Invention Grant
US07864532B1 Molded or encapsulated transmit-receive module or TR module/antenna element for active array
失效
用于有源阵列的模制或封装的发射接收模块或TR模块/天线元件
- Patent Title: Molded or encapsulated transmit-receive module or TR module/antenna element for active array
- Patent Title (中): 用于有源阵列的模制或封装的发射接收模块或TR模块/天线元件
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Application No.: US11944676Application Date: 2007-11-26
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Publication No.: US07864532B1Publication Date: 2011-01-04
- Inventor: Timothy Ehret , Bradley M. Smith
- Applicant: Timothy Ehret , Bradley M. Smith
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Duane Morris LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An array of electrically conductive waveguides is made a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered with the planar surfaces of another slab, to form one or more closed waveguides. The waveguides may feed microchips, or act as antennas. The slabs may include electrical conductors andor heat pipes. Heat pipes are made by defining apertures with the dielectric slabs, and introducing wick material into the apertures.
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