Invention Grant
- Patent Title: Printed circuit board assembly
- Patent Title (中): 印刷电路板组装
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Application No.: US11888611Application Date: 2007-08-01
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Publication No.: US07864544B2Publication Date: 2011-01-04
- Inventor: Mark W. Smith , Christopher A. Brandon
- Applicant: Mark W. Smith , Christopher A. Brandon
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Thomas N. Twomey
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A printed circuit board assembly includes a first printed circuit board having a plurality of electrical traces that is attached to a second printed circuit board having a plurality of electrical traces in a substantially perpendicular fashion. The first printed circuit board has a plurality of male terminal tabs that fit into a plurality of female terminal slots of the second printed circuit board to make a plurality of electrical connections between the electrical traces of the first printed circuit board and the electrical traces of the second printed circuit board. The assembly has at least two mechanical connections between the first printed circuit board and the second printed circuit board comprising connector blades that are substantially perpendicular to the first printed circuit board and to the second printed circuit board. The connector blades may also make electrical connections between electrical traces of the first and second printed circuit boards. A method of making an alternate printed circuit board for the assembly involves punching or drilling the alternate printed circuit board to provide a plurality of female terminals in an elongate slot.
Public/Granted literature
- US20090034222A1 Printed circuit board assembly and method of making a printed circuit board Public/Granted day:2009-02-05
Information query