Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.