Invention Grant
- Patent Title: Heat dissipation device with heat pipes
- Patent Title (中): 带热管的散热装置
-
Application No.: US11566003Application Date: 2006-12-01
-
Publication No.: US07866375B2Publication Date: 2011-01-11
- Inventor: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
- Applicant: Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28F7/00 ; H01L23/24 ; H05K7/20

Abstract:
A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
Public/Granted literature
- US20080128111A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES Public/Granted day:2008-06-05
Information query