Invention Grant
US07866534B2 Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method
有权
导体球安装装置，导体球安装方法，用于安装导体球的掩模和掩模制造方法
- Patent Title: Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method
- Patent Title (中): 导体球安装装置，导体球安装方法，用于安装导体球的掩模和掩模制造方法
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Application No.: US12166673Application Date: 2008-07-02
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Publication No.: US07866534B2Publication Date: 2011-01-11
- Inventor: Hideaki Sakaguchi , Kiyoaki Iida , Mitsutoshi Higashi
- Applicant: Hideaki Sakaguchi , Kiyoaki Iida , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2007-176328 20070704
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.
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