Invention Grant
- Patent Title: Drywall sander
- Patent Title (中): 干墙砂光机
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Application No.: US12239152Application Date: 2008-09-26
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Publication No.: US07867064B2Publication Date: 2011-01-11
- Inventor: Craig M. Field , Jeffrey L. Trudeau
- Applicant: Craig M. Field , Jeffrey L. Trudeau
- Applicant Address: US MI Traunik
- Assignee: EC Sander, L.L.C.
- Current Assignee: EC Sander, L.L.C.
- Current Assignee Address: US MI Traunik
- Agency: Price, Heneveld, Cooper, DeWitt & Litton, LLP
- Main IPC: B23B23/00
- IPC: B23B23/00

Abstract:
A drywall sander includes a replaceable sanding pad having a layer of resilient material, and an abrasive surface. The sanding pad includes one or more edge portions that project beyond the edges of a sander head. The edges of the sanding pad can be deformed during use when the sander is used in a corner or the like to thereby prevent scuffing or other damage to adjacent orthogonal surfaces.
Public/Granted literature
- US20090023370A1 DRYWALL SANDER Public/Granted day:2009-01-22
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