Invention Grant
US07867356B2 Apparatus for reducing polymer deposition on a substrate and substrate support
有权
用于减少基板和基板支撑件上的聚合物沉积的装置
- Patent Title: Apparatus for reducing polymer deposition on a substrate and substrate support
- Patent Title (中): 用于减少基板和基板支撑件上的聚合物沉积的装置
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Application No.: US11802212Application Date: 2007-05-21
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Publication No.: US07867356B2Publication Date: 2011-01-11
- Inventor: Jose Tong , Eric H. Lenz
- Applicant: Jose Tong , Eric H. Lenz
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/00 ; C23C14/00
Abstract:
An adjustable RF coupling ring is capable of reducing a vertical gap between a substrate and a hot edge ring in a vacuum processing chamber. The reduction of the gap reduces polymer deposits on the substrate and electrostatic chuck and improves wafer processing.
Public/Granted literature
- US20080041820A1 Apparatus for reducing polymer deposition on a substrate and substrate support Public/Granted day:2008-02-21
Information query
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