Invention Grant
US07867402B2 Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold
有权
用于实现多间隔器结构的方法,使用所述结构作为模具以及从所述模具获得的电路结构
- Patent Title: Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold
- Patent Title (中): 用于实现多间隔器结构的方法,使用所述结构作为模具以及从所述模具获得的电路结构
-
Application No.: US11539015Application Date: 2006-10-05
-
Publication No.: US07867402B2Publication Date: 2011-01-11
- Inventor: Danilo Mascolo , Gianfranco Cerofolini
- Applicant: Danilo Mascolo , Gianfranco Cerofolini
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- Agent Lisa K. Jorgenson; Robert Iannucci
- Priority: EP05425698 20051006
- Main IPC: H01L21/302
- IPC: H01L21/302 ; B82B3/00

Abstract:
A method realizes a multispacer structure including an array of spacers having same height. The method includes realizing, on a substrate, a sacrificial layer of a first material; b) realizing, on the sacrificial layer, a sequence of mask spacers obtained by SnPT, which are alternately obtained in at least two different materials; c) chemically etching one of the two different materials with selective removal of the mask spacers of this etched material and partial exposure of the sacrificial layer; d) chemically and/or anisotropically etching the first material with selective removal of the exposed portions of the sacrificial layer; e) chemically etching the other one of the two different materials with selective removal of the mask spacers of this etched material and obtainment of the multispacer structure.
Public/Granted literature
Information query
IPC分类: