Invention Grant
US07867402B2 Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold 有权
用于实现多间隔器结构的方法,使用所述结构作为模具以及从所述模具获得的电路结构

Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold
Abstract:
A method realizes a multispacer structure including an array of spacers having same height. The method includes realizing, on a substrate, a sacrificial layer of a first material; b) realizing, on the sacrificial layer, a sequence of mask spacers obtained by SnPT, which are alternately obtained in at least two different materials; c) chemically etching one of the two different materials with selective removal of the mask spacers of this etched material and partial exposure of the sacrificial layer; d) chemically and/or anisotropically etching the first material with selective removal of the exposed portions of the sacrificial layer; e) chemically etching the other one of the two different materials with selective removal of the mask spacers of this etched material and obtainment of the multispacer structure.
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