Invention Grant
- Patent Title: Injection mold and injection molding method using the same
- Patent Title (中): 注射模具和注射成型方法使用相同
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Application No.: US12633752Application Date: 2009-12-08
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Publication No.: US07867430B2Publication Date: 2011-01-11
- Inventor: Su-Dong Shin , Myoung-Jin Kim , Jeong-Hun Heo
- Applicant: Su-Dong Shin , Myoung-Jin Kim , Jeong-Hun Heo
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2009-0044192 20090520
- Main IPC: B29C45/22
- IPC: B29C45/22

Abstract:
Provided is an injection mold which can reduce the amount of resin that is separated from injection-molded parts and then thrown away. The injection mold includes for an embodiment an extension cylinder coupled to an upper clamp plate and having a nozzle at an end thereof; a nozzle positioner disposed under the nozzle, the nozzle positioner having a nozzle insertion groove adapted to receive the nozzle; a gate-lock-pin holder disposed under the extension cylinder and the nozzle positioner, comprising a gate lock pin which has a first end coupled to a gate molded part and a second end coupled to the gate-lock-pin holder, and adapted to separate the gate molded part from an injection-molded part; a gate stripper plate disposed under the gate-lock-pin holder and adapted to separate the gate molded part from the nozzle; and a cavity plate and a core plate disposed under the gate stripper plate and having a cavity which is shaped like the injection-molded part.
Public/Granted literature
- US20100295216A1 INJECTION MOLD AND INJECTION MOLDING METHOD USING THE SAME Public/Granted day:2010-11-25
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