Invention Grant
- Patent Title: Laser ablation resist
- Patent Title (中): 激光消融抗蚀剂
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Application No.: US11420817Application Date: 2006-05-30
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Publication No.: US07867688B2Publication Date: 2011-01-11
- Inventor: Scott E. Phillips , Timothy J. Tredwell , Lee W. Tutt , Glenn T. Pearce , Kelvin Nguyen , Ronald M. Wexler
- Applicant: Scott E. Phillips , Timothy J. Tredwell , Lee W. Tutt , Glenn T. Pearce , Kelvin Nguyen , Ronald M. Wexler
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Nelson A. Blish; J. Lanny Tucker
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/20 ; G03F7/36
Abstract:
A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.
Public/Granted literature
- US20070281247A1 LASER ABLATION RESIST Public/Granted day:2007-12-06
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