Invention Grant
- Patent Title: Method for manufacturing a microstructure, exposure device, and electronic apparatus
- Patent Title (中): 微结构，曝光装置和电子设备的制造方法
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Application No.: US11153553Application Date: 2005-06-16
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Publication No.: US07867692B2Publication Date: 2011-01-11
- Inventor: Jun Amako , Atsushi Takakuwa , Daisuke Sawaki
- Applicant: Jun Amako , Atsushi Takakuwa , Daisuke Sawaki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-245161 20040825; JP2004-245169 20040825; JP2004-245177 20040825; JP2005-010420 20050118
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
Aspects of the invention can provide a method for manufacturing a microstructure, including forming a photosensitive film above a work piece, exposing the photosensitive film, as a first exposure, by irradiating interference light generated by intersecting two laser beams having a wavelength shorter than a wavelength of visible light, developing the exposed photosensitive film so as to develop a shape corresponding to a pattern of the interference light to the photosensitive film, and etching the work piece using the developed photosensitive film as an etching mask.
Public/Granted literature
- US20060046156A1 Method for manufacturing a microstructure, exposure device, and electronic apparatus Public/Granted day:2006-03-02
Information query
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