Invention Grant
- Patent Title: Methods for forming device structures on a wafer
- Patent Title (中): 在晶片上形成器件结构的方法
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Application No.: US11681008Application Date: 2007-03-01
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Publication No.: US07867693B1Publication Date: 2011-01-11
- Inventor: Walter D. Mieher
- Applicant: Walter D. Mieher
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corp.
- Current Assignee: KLA-Tencor Technologies Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/00 ; G03F7/26 ; G03F7/40
Abstract:
Methods for forming device structures on a wafer are provided. One method includes transferring approximately an inverse of patterned features formed in a positive resist layer on the wafer to a device material on the wafer to form the device structures in the device material. Another method includes transferring approximately an inverse of patterned features formed in a sacrificial layer on the wafer to a device material on the wafer to form the device structures in the device material.
Information query
IPC分类:
