Invention Grant
- Patent Title: Shield flat cable and manufacturing method thereof
- Patent Title (中): 屏蔽扁平电缆及其制造方法
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Application No.: US12271067Application Date: 2008-11-14
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Publication No.: US07868254B2Publication Date: 2011-01-11
- Inventor: Koya Matsushita , Tatsuo Matsuda , Ken Yanagida , Hideo Kobayashi
- Applicant: Koya Matsushita , Tatsuo Matsuda , Ken Yanagida , Hideo Kobayashi
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPP2007-297316 20071115
- Main IPC: H01B7/08
- IPC: H01B7/08

Abstract:
A manufacturing method of a flat shield cable has a step of arranging a plurality of flat conductors including a ground line parallel with each other in one plane at a pitch P, a step of forming a flat cable by laminating a first insulating film on the flat conductors from both sides of an arrangement plane of the flat conductors, a step of laminating a shield layer on outside surfaces of the flat cable, and a step of electrically connecting the ground line to the shield layer. The manufacturing method further has a step of cutting the ground line at a portion other than in the conductor exposure portions and folding cutting portions of the ground line to outside the first insulating film before laminating the shield layer, and a step of electrically connecting only the folded ground line among the flat conductors to the shield layer.
Public/Granted literature
- US20090126972A1 SHIELD FLAT CABLE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-05-21
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