Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method thereof
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US11785535Application Date: 2007-04-18
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Publication No.: US07868312B2Publication Date: 2011-01-11
- Inventor: Homare Sato
- Applicant: Homare Sato
- Applicant Address: JP Chuo-ku, Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Chuo-ku, Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-116388 20060420
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
A semiconductor memory device is provided in which a phase-change layer can be formed stably and electric current required to cause the phase change of the phase-change layer can be reduced. An edge portion of the phase-change layer is formed above a lower electrode. The edge portion is formed to assume a tapered shape in cross section such that the thickness of the phase-change layer varies above the contact area between the lower electrode and the phase-change layer. The tapered portion is filled with an oxide film. According to this configuration, the region in which the phase-change occurs can be restricted, and hence the phase-change layer can be heated efficiently, resulting in reduction of electric current required for heating.
Public/Granted literature
- US20070246440A1 Semiconductor memory device and manufacturing method thereof Public/Granted day:2007-10-25
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