Invention Grant
US07868325B2 Semiconductor wafer of single crystalline silicon and process for its manufacture 有权
单晶硅半导体晶圆及其制造工艺

  • Patent Title: Semiconductor wafer of single crystalline silicon and process for its manufacture
  • Patent Title (中): 单晶硅半导体晶圆及其制造工艺
  • Application No.: US12372783
    Application Date: 2009-02-18
  • Publication No.: US07868325B2
    Publication Date: 2011-01-11
  • Inventor: Wilfried von Ammon
  • Applicant: Wilfried von Ammon
  • Applicant Address: DE Munich
  • Assignee: Siltronic AG
  • Current Assignee: Siltronic AG
  • Current Assignee Address: DE Munich
  • Agency: Brooks Kushman P.C.
  • Priority: DE102008013325 20080310
  • Main IPC: H01L29/04
  • IPC: H01L29/04
Semiconductor wafer of single crystalline silicon and process for its manufacture
Abstract:
Semiconductor wafer of monocrystalline silicon contain fluorine, the fluorine concentration being 1·1010 to 1·1016 atoms/cm3, and is free of agglomerated intrinsic point defects whose diameter is greater than or equal to a critical diameter. The semiconductor wafers are produced by providing a melt of silicon which is doped with fluorine, and crystallizing the melt to form a single crystal which contains fluorine within the range of 1·1010 to 1·1016 atoms/cm3, at a growth rate at which agglomerated intrinsic point defects having a critical diameter or larger would arise if fluorine were not present or present in too small an amount, and separating semiconductor wafers from the single crystal.
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