Invention Grant
- Patent Title: Semiconductor wafer of single crystalline silicon and process for its manufacture
- Patent Title (中): 单晶硅半导体晶圆及其制造工艺
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Application No.: US12372783Application Date: 2009-02-18
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Publication No.: US07868325B2Publication Date: 2011-01-11
- Inventor: Wilfried von Ammon
- Applicant: Wilfried von Ammon
- Applicant Address: DE Munich
- Assignee: Siltronic AG
- Current Assignee: Siltronic AG
- Current Assignee Address: DE Munich
- Agency: Brooks Kushman P.C.
- Priority: DE102008013325 20080310
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
Semiconductor wafer of monocrystalline silicon contain fluorine, the fluorine concentration being 1·1010 to 1·1016 atoms/cm3, and is free of agglomerated intrinsic point defects whose diameter is greater than or equal to a critical diameter. The semiconductor wafers are produced by providing a melt of silicon which is doped with fluorine, and crystallizing the melt to form a single crystal which contains fluorine within the range of 1·1010 to 1·1016 atoms/cm3, at a growth rate at which agglomerated intrinsic point defects having a critical diameter or larger would arise if fluorine were not present or present in too small an amount, and separating semiconductor wafers from the single crystal.
Public/Granted literature
- US20090224366A1 Semiconductor Wafer Of Single Crystalline Silicon and Process For Its Manufacture Public/Granted day:2009-09-10
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