Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12071523Application Date: 2008-02-21
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Publication No.: US07868329B2Publication Date: 2011-01-11
- Inventor: Seok-Woon Lee , Sung-Soo Park , Biing-Seng Wu
- Applicant: Seok-Woon Lee , Sung-Soo Park , Biing-Seng Wu
- Applicant Address: TW Tainan County TW Miao-Li County
- Assignee: Chi Mei El Corp.,Chimei Innolux Corporation
- Current Assignee: Chi Mei El Corp.,Chimei Innolux Corporation
- Current Assignee Address: TW Tainan County TW Miao-Li County
- Agency: Rabin & Berdo, PC
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
A semiconductor device, comprising a substrate, a semiconductive layer and a gate electrode is provided. The semiconductive layer having a crystallization promoting material is formed over the substrate. The semiconductive layer has a channel region, a first doped region and a second doped region. The first doped region has a donor and an acceptor, and the second doped region has a dopant which is selected from one of the donor and the acceptor. The second doped region is disposed between the first doped region and the channel region. The gate electrode is insulated from the channel region.
Public/Granted literature
- US20090212293A1 Semiconductor device and method for fabricating the same Public/Granted day:2009-08-27
Information query
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