Invention Grant
- Patent Title: Semiconductor light emitting device
- Patent Title (中): 半导体发光器件
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Application No.: US12729310Application Date: 2010-03-23
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Publication No.: US07868342B2Publication Date: 2011-01-11
- Inventor: Hideto Furuyama
- Applicant: Hideto Furuyama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-149494 20070605
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A semiconductor light emitting device includes a silicon substrate, a p-type semiconductor layer provided on the silicon substrate, a n-type semiconductor layer provided on the silicon substrate, the n-type semiconductor layer adjoining the p-type semiconductor layer, and a light emitting section formed at a p-n homojunction between the p-type semiconductor layer and the n-type semiconductor layer. The p-n homojunction is substantially perpendicular to a major surface of the silicon substrate. The p-n homojunction is corrugated with a period matched with an integer multiple of an emission wavelength at the light emitting section.
Public/Granted literature
- US20100171141A1 SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2010-07-08
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