Invention Grant
- Patent Title: Silicon break over diode
- Patent Title (中): 硅破二极管
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Application No.: US12284717Application Date: 2008-09-23
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Publication No.: US07868352B2Publication Date: 2011-01-11
- Inventor: David M. Giorgi , Tajchai Navapanich
- Applicant: David M. Giorgi , Tajchai Navapanich
- Applicant Address: US CA San Diego
- Assignee: OptiSwitch Technology Corporation
- Current Assignee: OptiSwitch Technology Corporation
- Current Assignee Address: US CA San Diego
- Agent David H. Carroll
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/87

Abstract:
A Break Over Diode (“BOD”) device is a gate-less two terminal high power semiconductor switch in which transitions from a blocking state to a conducting state are triggered by a dV/dt pulse to the anode. The BOD device can be thought of as two cross-coupled PNP and NPN transistors, and includes both anode and cathode shorts which reduce the gain of the NPN and PNP transistors by shunting some current away from their bases directly to their emitters, thereby improving blocking. Moreover, the anode and cathode shorts in conjunction with the device blocking junction form PN diodes which are distributed throughout the bulk of the material and function as anti-parallel diodes to the base-emitter junctions of the PNP and NPN transistors, which enables the BOD device to handle a larger current reversal for a longer period of time. The P base layer may be made thin to decrease the voltage fall time from full blocking to full conduction, and the cathode and anode shorts may be provided in a honeycomb pattern.
Public/Granted literature
- US20100072512A1 Silicon break over diode Public/Granted day:2010-03-25
Information query
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