Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12071124Application Date: 2008-02-15
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Publication No.: US07868359B2Publication Date: 2011-01-11
- Inventor: Toshifumi Takahashi
- Applicant: Toshifumi Takahashi
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2007-057119 20070307
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
In a semiconductor device including multiple unit cells arranged in an array, transistors are affected by a stress from an STI at different degrees depending on the position in the array. As a result, a variation occurs in transistor characteristic. In a semiconductor device according to the present invention, each of predetermined transistors in outermost unit blocks in the array has a transistor size according to the stress from the STI.
Public/Granted literature
- US20080217704A1 Semiconductor device Public/Granted day:2008-09-11
Information query
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