Invention Grant
- Patent Title: Semiconductor device with increased drain breakdown voltage
- Patent Title (中): 半导体器件具有增加的漏极击穿电压
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Application No.: US11072268Application Date: 2005-03-07
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Publication No.: US07868385B2Publication Date: 2011-01-11
- Inventor: Hiromichi Ichikawa
- Applicant: Hiromichi Ichikawa
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2004-301787 20041015
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor device is disclosed that is capable of improving the drain breakdown voltage during operation. The semiconductor device includes a first drain region that is arranged to extend from the vicinity of an end portion of the gate electrode at the drain electrode side in a direction toward the drain electrode, a drain contact region that is formed within the first drain region and comes into contact with the drain electrode, and a second drain region that is formed around and underneath the drain contact region. The second drain contact region has an impurity concentration that is higher than the impurity concentration of the first drain contact region and lower than the impurity concentration of the drain contact region. An end portion of the second drain region at the gate electrode side is positioned away from the end portion of the gate electrode by a predetermined distance.
Public/Granted literature
- US20060081924A1 Semiconductor device and manufacturing method of the same Public/Granted day:2006-04-20
Information query
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